System in Package (SiP) Technology Market Competitive Landscape: Analysis of Key Players, Market Share, and Strategies
System in package (SiP)
technology market size is valued at USD 24,302.85 million by 2028 is expected
to grow at a compound annual growth rate of 10.40% in the forecast
period of 2021 to 2028. Data Bridge Market Research report on system in package
(SiP) technology provides analysis and insights regarding the various factors
expected to be prevalent throughout the forecasted period while providing their
impacts on the market’s growth.
Market Insights and Scope
System in package (SiP)
technology generally refers to a module where numbers of integrated circuits
are enclosed and create various enhanced packaging applications to build up
solutions that can be customized as per the user requirement. SiP is largely
used in digital music player, mobile phones and in many electronic functions.
Systems on Chip (SoC) have several advantages such as flexibility, low product
cost, low research and development cost, low NRE (non-recurring engineering)
cost among others.
The high adoption
of smartphones and smart wearables is expected to influence the
growth of system in package (SiP) technology market over the forecast period of
2021 to 2028. Also the introduction of 5G network connected devices has raised
the demand for system in package technology to incorporate 5G supporting
components in same space is also anticipated to flourish the growth of the
system in package (SiP) technology market. Furthermore, the rise in demand for
high-performance electronic devices and appearance of advanced and compact
consumer electronic devices and conventional packaging cost of ICs such
as, packaging with the variation of sizes of the ICs are also likely
to positively impact the growth of the system in package (SiP) technology
market.
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